Security mainly includes: closed-circuit monitoring systems, burglar alarm systems, building intercom systems, parking management systems, community card system, infrared perimeter alarm systems, electronic fences, patrol systems, time and attendance access control systems, security room systems, electronic examination systems, intelligent door locks and so on.
Product Description
Security mainly includes: closed-circuit monitoring systems, burglar alarm systems, building intercom systems, parking management systems, community card system, infrared perimeter alarm systems, electronic fences, patrol systems, time and attendance access control systems, security room systems, electronic examination systems, intelligent door locks and so on. Due to the wide range of security equipment application scenarios, the motherboard in the production of the initial need to simulate the test in a particular environment to ensure that different environments can be stable operation. A qualified motherboard in the factory before, often after 48 hours of batch aging test, test items including high and low temperature, static electricity, vibration and surge, etc. PCBA production process requirements are also increasingly high, need to do explosion-proof, anti-corrosion, insulation, etc..
As a PCB design and PCB assembly company with more than 20 years of experience, Minteda has advanced international technology, intelligent production and testing equipment to meet your requirements. In the area of security control, Mintec has completed the certification and approval of many strategic key customers of listed companies. We provide you with the following specifications, from small sample to mass production of security class motherboard products, including PCB design, PCBA placement and DIP packaging services.
Elevator security reminder advertising machine
Access Control Attendance Machine
IOT face recognition
Millions of HD mobile night vision camera PCBA route board
Process Capability
Solder paste printer printing accuracy: ±0.02mm
Printing repeat positioning accuracy: ±0.0125mm
Equipment material rejection rate: within 5 parts per million
Mounting component size: CHIP 01005 (imperial) ~ 100*90*21mm IC
Mounting accuracy: ±0.035mm
Mounting Repeat positioning accuracy ±0.025mm
CPK≥1.0
SMT workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature.
With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board), and also can reduce the high temperature oxidation of solder and not easy to produce compounds with metal, but also to avoid metal oxidation because of air nitrogen is an inert gas, which to ensure the quality of solder and product Reliability.
